The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2023
Filed:
Feb. 17, 2021
Infineon Technologies Ag, Neubiberg, DE;
Oliver Markus Kreiter, Warstein, DE;
Ludwig Busch, Erwitte, DE;
Angel Enverga, Melaka, MY;
Mei Fen Hiew, Melaka, MY;
Tian See Hoe, Melaka, MY;
Elvis Keli, Bad Sassendorf, DE;
Kean Ming Koe, Penang, MY;
Sanjay Kumar Murugan, Melaka, MY;
Michael Niendorf, Verl, DE;
Ivan Nikitin, Regensburg, DE;
Bernhard Stiller, Rott am Inn, DE;
Thomas Stoek, Buxtehude, DE;
Ke Yan Tean, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor module includes: a dual-gauge leadframe having thicker and thinner parts, part of the thinner part forming a high voltage lead; a semiconductor die attached to the thicker part; and a molding compound (MC) encapsulating the die. The thicker leadframe part is disposed at a bottom side of the MC. A side face of the MC has a stepped region between the high voltage lead and thicker leadframe part. A first generally vertical part of the stepped region extends from the high voltage lead to the generally horizontal part, a generally horizontal part of the stepped region extends to the second generally vertical part, and a second generally vertical part of the stepped region extends to the bottom side of the MC. A linear dimension of the generally horizontal part as measured from the first generally vertical part to the second generally vertical part is at least 4.5 mm.