Company Filing History:
Years Active: 2006
Title: Innovations of Thomas R Homa
Introduction
Thomas R Homa is a notable inventor based in Binghamton, NY (US). He has made significant contributions to the field of semiconductor technology, particularly in enhancing the reliability of chip connections. With a total of 2 patents to his name, Homa's work focuses on improving the performance and durability of solder connections in electronic devices.
Latest Patents
Homa's latest patents include a method and structure for extending the fatigue life of C4 solder ball to chip connections. This innovation involves coupling a semiconductor substrate, such as a semiconductor chip, to an organic substrate, like a chip carrier. The design aims to interface a solder member, specifically a solder ball, to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. By optimizing the surface area of the pads and the distance from the centerline of the solder member to the closest lateral edge of the semiconductor substrate, thermal strains during thermal cycling can be significantly reduced.
Career Highlights
Homa is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to collaborate with other talented professionals in the field, contributing to advancements in semiconductor technology.
Collaborations
Some of Homa's notable coworkers include William E Bernier and Charles F Carey. Their collective expertise has fostered an environment of innovation and progress within their projects.
Conclusion
Thomas R Homa's contributions to semiconductor technology through his patents demonstrate his commitment to enhancing the reliability of electronic devices. His work continues to influence the industry and pave the way for future innovations.