International Business Machines Corporation

Thomas R Homa

Eric A Johnson

Irving Memis

William E Bernier

Son K Tran

Charles F Carey

Robert F White

Pierre M Langevin

Eberhard B Gramatzki

A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.

Extension of fatigue life for C4 solder ball to chip connection

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Binghamton, NY, United States of America

Thomas R Homa