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For the Inventor, By the Inventor

Munich, Germany

Thomas Laska

USPTO Granted Patents = 11

Average Co-Inventor Count = 5.3

ph-index = 5

Forward Citations = 126(Granted Patents)


Location History:

  • Munchen, DE (2000)
  • München, DE (2001 - 2010)
  • Munich, DE (1998 - 2020)

Company Filing History:

goldMedal7 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal3 out of 30,028 
 
Siemens Aktiengesellschaft
 patents
bronzeMedal1 out of 2,093 
 
Infineon Technologies Austria Ag
 patents

Years Active: 1998-2020

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11 patents (USPTO):
1. 10777506 - Silicon carbide semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device (2020-09-15),
2. 10475743 - Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device (2019-11-12),
3. 8030744 - Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same (2011-10-04),
4. 7851913 - Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart (2010-12-14),
5. 7709938 - Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same (2010-05-04),
6. 7709887 - Semiconductor component and method (2010-05-04),
7. 7005761 - Circuit configuration for off-load switching, switch mode power supply, clocked supply, voltage regulator, lamp switch, and methods for operating the circuit configuration (2006-02-28),
8. 6309965 - Method of producing a semiconductor body with metallization on the back side that includes a titanium nitride layer to reduce warping (2001-10-30),
9. 6309920 - Bipolar transistor which can be controlled by field effect and method for producing the same (2001-10-30),
10. 6147403 - Semiconductor body with metallizing on the back side (2000-11-14),
11. 5726474 - Field effect controlled semiconductor component with integrated (1998-03-10),

Title: Thomas Laska: Pioneering Innovations in Semiconductor Technology

Introduction:

Thomas Laska, a visionary inventor based in Munich, Germany, is a driving force in the realm of semiconductor technology. With a remarkable portfolio of 11 patents, Laska's ingenuity and dedication to technological advancement have left an indelible mark on the industry.

Latest Patents:

Among his latest patents is the groundbreaking "Silicon Carbide Semiconductor Device with Metal Adhesion and Barrier Structure." This innovation features a metal structure connected to a silicon carbide semiconductor body, with a titanium and tungsten-based adhesion and barrier structure. Another notable patent is the "Semiconductor Device with Metal Adhesion and Barrier Structure," showcasing Laska's expertise in creating effective metal structures for semiconductor devices.

Career Highlights:

Having worked at esteemed companies such as Infineon Technologies AG and Siemens Aktiengesellschaft, Thomas Laska has garnered invaluable experience in the field of semiconductor technology. His contributions have not only pushed the boundaries of innovation but have also paved the way for future advancements in the industry.

Collaborations:

Throughout his career, Thomas Laska has collaborated with industry experts such as Frank Hille and Frank Umbach. These partnerships have led to the development of groundbreaking technologies and have fostered a culture of innovation and collaboration within the semiconductor sector.

Conclusion:

Thomas Laska's passion for innovation and his unwavering commitment to technological progress continue to inspire individuals within the industry. His relentless pursuit of excellence has propelled him to the forefront of semiconductor technology, shaping the future of the field and influencing the next generation of inventors.

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