The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2010

Filed:

Nov. 20, 2006
Applicants:

Thomas Gutt, Taufkirchen, DE;

Dirk Siepe, Warstein, DE;

Thomas Laska, Munich, DE;

Michael Melzl, Neutraubling, DE;

Matthias Stecher, Munich, DE;

Roman Roth, Sattendorf, AT;

Inventors:

Thomas Gutt, Taufkirchen, DE;

Dirk Siepe, Warstein, DE;

Thomas Laska, Munich, DE;

Michael Melzl, Neutraubling, DE;

Matthias Stecher, Munich, DE;

Roman Roth, Sattendorf, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device exhibits a first metal layer, made of a first metal, with at least one contiguous subsection. At least one second metal layer, made of a second metal, is placed on the contiguous subsection of the first metal layer. The second metal is harder than the first metal. The second metal layer is structured to form at least two layer regions, which are disposed on the contiguous subsection of the first metal layer. The second metal exhibits a boron-containing or phosphorus-containing metal or a boron-containing or phosphorus-containing metal alloy.


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