Company Filing History:
Years Active: 1999-2007
Title: Innovations of Thomas J Jasinski
Introduction
Thomas J Jasinski is a notable inventor based in Lebanon, NH (US), recognized for his contributions to thermal processing technologies. He holds two patents that showcase his innovative approach to heat exchange and rapid thermal processing.
Latest Patents
One of Jasinski's latest patents is a heat exchanger designed to utilize a working fluid with a high heat flux transfer capacity. This heat exchanger comprises a core with a heat transfer surface, along with inlet and outlet manifolds that are strategically positioned across the width of the core. The design includes interconnecting channels that facilitate fluid communication with the manifolds, allowing for efficient heat transfer. The working fluid is directed towards and away from the heat transfer surface, optimizing the heat exchange process.
Another significant patent is for an apparatus aimed at rapid thermal processing of silicon wafers. This apparatus features a heating element, sensing element, and cooling element, all arranged to interact with the backside of a silicon wafer. The method involves rapidly heating the wafer, applying processing assists, and then cooling it down. The apparatus includes an array of sensing elements for precise control of the heating elements, ensuring uniform processing across the wafer.
Career Highlights
Throughout his career, Jasinski has worked with prominent companies such as Sematech, Inc. and Mikros Manufacturing, Inc. His experience in these organizations has contributed to his expertise in thermal processing technologies.
Collaborations
Jasinski has collaborated with notable professionals in the field, including Franz T Geyling and Javier A Valenzuela. These collaborations have likely enriched his work and led to further advancements in his inventions.
Conclusion
Thomas J Jasinski's innovative patents and career achievements highlight his significant contributions to the field of thermal processing. His work continues to influence advancements in heat exchange technologies and silicon wafer processing.