Heater and temperature sensor array for rapid thermal processing thermal

Abstract

An apparatus for rapid thermal processing of silicon wafers is provided. The apparatus may include a heating element, sensing element and a cooling element, all of which are positioned in opposing relation to a backside of a silicon wafer. A method of using the apparatus includes using the apparatus to rapidly heat a wafer, apply desired processing assists, and rapidly cool the wafer. The apparatus may also include an array of sensing elements which are interposed between heating elements. The sensing elements may be a combination of absolute and relative sensors. The array permits accurate zonal control of the heating elements and prevents cross talk between the heaters. The apparatus may be used to monitor the temperature at various points across a wafer and to control the associated heating elements in response to the monitoring step. The apparatus may also include a high speed rotating support for the wafer. Further, the apparatus may include a shroud surrounding the wafer which allows for more uniform processing across the wafer. Also, an inlet structure for introducing processing assists which contours to the shape of the shroud is disclosed. A method for using the apparatus includes utilizing the inlet structure to provide processing assists over the surface of a wafer and obtaining uniform depositions by aid of the shroud.