Thomas J Debonis

Title: Thomas J Debonis: Innovator in Electronics Packaging

Introduction

Thomas J Debonis is a notable inventor based in Tempe, AZ (US), recognized for his contributions to electronics packaging. With a total of 2 patents, he has made significant advancements in the field, particularly through his work at Intel Corporation.

Latest Patents

Debonis's latest patents include innovative technologies that enhance the functionality and efficiency of electronic devices. One of his patents, titled "Micro-trenching mold interface in a pop package," describes an electronics package that comprises a package substrate and a die on the substrate. This invention features a mold layer positioned over the substrate, along with through-mold interconnects and a trench that extends into the mold layer. Another patent, "Protective layer during scribing," outlines a method for forming a chemically soluble coating on exposed contacts of a circuit substrate. This method involves scribing the substrate along designated areas and subsequently removing a portion of the coating after scribing.

Career Highlights

Throughout his career, Thomas J Debonis has been instrumental in developing cutting-edge technologies that push the boundaries of electronics packaging. His work at Intel Corporation has allowed him to collaborate with some of the brightest minds in the industry, contributing to the advancement of electronic device manufacturing.

Collaborations

Debonis has worked alongside talented colleagues such as Sujit Sharan and Kumar Abhishek Singh, fostering a collaborative environment that encourages innovation and creativity.

Conclusion

Thomas J Debonis stands out as a significant figure in the realm of electronics packaging, with his patents reflecting his commitment to innovation. His contributions continue to shape the future of electronic devices, making him a valuable asset to the industry.