Intel Corporation

Thomas J Debonis

Sujit Sharan

Robert M Nickerson

Zhaozhi Li

Kumar Abhishek Singh

Rees Winters

Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.

Micro-trenching mold interface in a pop package

A method including forming a chemically soluble coating on a plurality exposed contacts on a surface of a circuit substrate; scribing the surface of the substrate along scribe areas; and after scribing, removing a portion of the coating. A method including forming a circuit structure comprises a plurality of exposed contacts on a surface, a location of the exposed contacts defined by a plurality of scribe streets; forming a coating comprising a chemically soluble material on the exposed contacts; scribing the surface of the substrate along the scribe streets; and after scribing, removing the coating. A method including coating a surface of a circuit substrate comprising a plurality of exposed contacts with a chemically soluble material; scribing the surface of the substrate along scribe areas; removing the coating; and sawing the substrate in the scribe areas.

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Tempe, AZ, United States of America

Thomas J Debonis