Thomas F Kauffman

This inventor holds 38 USPTO granted patents and 8 published patent applications, plus 4 CIPO patents and 8 EPO patents, primarily in Hot Melt Adhesives. Top assignees: National Starch and Chemical Investment Holding Corporation, H.b. Fuller Company, H.b. Fuller Licensing & Financing Inc.. Active years: 1989-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Thomas F Kauffman. Retrieved from https://idiyas.com/inventor/thomas-f-kauffman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 38 (Patent Applications = 8)

% Patents Active = 89.5

CIPO Patents = 4

EPO Patents = 8 (Patent Applications = 9)

Average Co-Inventor Count = 3.3

ph-index = 19

Forward Citations = 842(Granted Patents)

Location History:

Phillipsburg, NJ (US) (1989)
Easton, PA (US) (1989 - 1996)
Harleysville, PA (US) (2003 - 2011)
Woodbury, MN (US) (1998 - 2023)
Bloomfield, CT (US) (2024)

Company Filing History:

12 out of 682

National Starch and Chemical Investment Holding Corporation

H.b. Fuller Licensing & Financing Inc.

patents

4. 5 out of 3,444

Rohm and Haas Company

patents

5. 3 out of 314

National Starch and Chemical Corporation

patents

6. 2 out of 7,680

The Dow Chemical Company

8. 1 out of 834,453

Other

patents

where one patent can have more than one assignee

Years Active: 1989-2026

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Areas of Expertise:

Photovoltaic Modules

Encapsulation

Recyclable Compositions

Polymer

Adhesive

Biomass

Heat Stability

Low Application Temperature

Hydrophilic

Block Copolymers

Polylactide

Water-Sensitive

38 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12692378 - Hot melt composition in the form of a film for use in photovoltaic modules (2026-07-28),

2. 12119422 - Systems and methods for encapsulating an electronic component (2024-10-15),

3. 12049547 - Hot melt composition in the form of a film for use in thin film photovoltaic modules (2024-07-30),

4. 11667816 - Hot melt adhesive compositions including non-single she catalyzed amorphous poly alpha-olefin polymer, and articles including the same (2023-06-06),

5. 10844253 - Hot melt adhesive compositions that include semi-crystalline propylene polymer and wax and articles including the same (2020-11-24),

6. 10787596 - Reactive hot melt adhesive having high initial strength, good heat stability and low monomeric diisocyanate (2020-09-29),

7. 10619081 - Hot melt adhesive composition (2020-04-14),

8. 10584267 - Low application temperature hot melt adhesive composition and a method including the same (2020-03-10),

9. 10392537 - Propylene polymer-based hot melt adhesive composition exhibiting fast set time and articles including the same (2019-08-27),

10. 8013068 - Michael addition compositions (2011-09-06),

11. 7514528 - Biomass based Michael addition compositions (2009-04-07),

12. 7473734 - Michael addition compositions (2009-01-06),

13. 7396429 - Michael addition compositions (2008-07-08),

14. 7199180 - Adhesives comprising olefin polymers (2007-04-03),

15. 6926959 - Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks (2005-08-09),

Title: Thomas F. Kauffman: Innovator in Electronic Component Encapsulation

Introduction

Thomas F. Kauffman, an accomplished inventor based in Woodbury, Minnesota, holds an impressive portfolio of 21 patents. His work focuses on innovative solutions in the field of electronic component encapsulation, demonstrating his commitment to advancing technology.

Latest Patents

Kauffman's recent patents include significant advancements such as the "Systems and methods for encapsulating an electronic component." This invention presents a detailed method for applying a first layer of an encapsulating composition onto an electronic component, ensuring that the interface remains free of voids. Additionally, he has developed a "Hot melt composition in the form of a film for use in thin film photovoltaic modules," which includes a unique blend of non-functionalized and functionalized polymers. This film is crucial in improving the performance and durability of thin film photovoltaic modules.

Career Highlights

Throughout his career, Kauffman has been associated with notable companies like H.B. Fuller Company and H.B. Fuller Licensing & Financing Inc. His experience in these organizations has undoubtedly contributed to his expertise and innovation in the encapsulation technologies he has developed.

Collaborations

In his pursuit of innovation, Kauffman has collaborated with esteemed colleagues, including Eugene R. Simmons and Michael John Zajaczkowski. Their teamwork reflects the collaborative spirit that drives success in the field of technology and innovation.

Conclusion

Thomas F. Kauffman's contributions to the world of inventions, particularly in the realm of electronic component encapsulation, showcase his dedication to enhancing technological processes. With a robust list of patents and a rich career history, he continues to impact the industry profoundly.

Profile summary based on public USPTO records.