Woodbury, MN, United States of America

Thomas F Kauffman

USPTO Granted Patents = 21 


 

Average Co-Inventor Count = 3.8

ph-index = 11

Forward Citations = 407(Granted Patents)


Location History:

  • Harleysville, PA (US) (2003 - 2011)
  • Woodbury, MN (US) (1998 - 2023)
  • Bloomfield, CT (US) (2024)

Company Filing History:


Years Active: 1998-2024

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21 patents (USPTO):Explore Patents

Title: Thomas F. Kauffman: Innovator in Electronic Component Encapsulation

Introduction

Thomas F. Kauffman, an accomplished inventor based in Woodbury, Minnesota, holds an impressive portfolio of 21 patents. His work focuses on innovative solutions in the field of electronic component encapsulation, demonstrating his commitment to advancing technology.

Latest Patents

Kauffman's recent patents include significant advancements such as the "Systems and methods for encapsulating an electronic component." This invention presents a detailed method for applying a first layer of an encapsulating composition onto an electronic component, ensuring that the interface remains free of voids. Additionally, he has developed a "Hot melt composition in the form of a film for use in thin film photovoltaic modules," which includes a unique blend of non-functionalized and functionalized polymers. This film is crucial in improving the performance and durability of thin film photovoltaic modules.

Career Highlights

Throughout his career, Kauffman has been associated with notable companies like H.B. Fuller Company and H.B. Fuller Licensing & Financing Inc. His experience in these organizations has undoubtedly contributed to his expertise and innovation in the encapsulation technologies he has developed.

Collaborations

In his pursuit of innovation, Kauffman has collaborated with esteemed colleagues, including Eugene R. Simmons and Michael John Zajaczkowski. Their teamwork reflects the collaborative spirit that drives success in the field of technology and innovation.

Conclusion

Thomas F. Kauffman's contributions to the world of inventions, particularly in the realm of electronic component encapsulation, showcase his dedication to enhancing technological processes. With a robust list of patents and a rich career history, he continues to impact the industry profoundly.

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