The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Mar. 06, 2020
Applicant:

H.b. Fuller Company, St. Paul, MN (US);

Inventors:

Peter Remmers, Hamburg, DE;

Volker K. Kestler, Wrestedt, DE;

Thomas F. Kauffman, Woodbury, MN (US);

Assignee:

H.B. Fuller Company, St. Paul, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 31/048 (2014.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); H01L 21/67126 (2013.01); H01L 31/0481 (2013.01);
Abstract

A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.


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