H.b. Fuller Company

H.b. Fuller Licensing & Financing Inc.

Rohm and Haas Company

The Dow Chemical Company

Other

Thomas F Kauffman

Eugene R Simmons

Michael John Zajaczkowski

John P Baetzold

Mark S Kroll

David B Malcolm

Cynthia L Rickey

David William Whitman

Ronald Scott Beckley

Margarita Acevedo

Jeffrey S Lindquist

Scott Charles Schmidt

Thomas H Quinn

Robert A Dubois

Janelle C Cameron

Steven L Scholl

Steven W Albrecht

Timothy W Roska

Kathryn A Coleman

Beth M Eichler

Maynard Lawrence

Amanda L Schmit

William L Bunnelle

Selim Yalvac

Deepak R Parikh

Joseph James Zupancic

Mai Chen

David Elmer Vietti

Sharf U Ahmed

Malcolm F Finlayson

Peter Remmers

David R Speth

Keith C Knutson

Steven R Vaughan

Beth M Eichler-Johnson

Claudia Mosanu

Sunil K Pillalamarri

Jimmy D Allen

Michael S Keehr

Luke A Strzegowski

Jayesh G Bokria

Volker K Kestler

Yiming Zeng

Gary J Roy

James E Welton

Andrew R Michel

Richard B Sergeant

Kim M Larson

Scott C Schmidt

Gary L Roy

A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.

Systems and methods for encapsulating an electronic component

The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer. The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.

Hot melt composition in the form of a film for use in thin film photovoltaic modules

The invention features hot melt adhesive compositions including from 50% by weight to 95% by weight of a non-single site catalyzed amorphous poly alpha-olefin copolymer derived from propylene and at least one monomer selected from the group consisting of butene and hexene and having a viscosity of no greater 10,000 cP at 190&#xb0; C. and from 5% by weight to 45% by weight of a polybutene-1 polymer.

Hot melt adhesive compositions including non-single she catalyzed amorphous poly alpha-olefin polymer, and articles including the same

A hot melt adhesive composition that includes at least 40% by weight of an unmodified, semi-crystalline propylene polymer that includes at least 50% by weight propylene, and at least 15% by weight wax.

Hot melt adhesive compositions that include semi-crystalline propylene polymer and wax and articles including the same

The invention includes a reactive hot melt adhesive composition including an isocyanate functional prepolymer derived from a polyfunctional isocyanate having a functionality of about 2 or more and a polyol, an active hydrogen organofunctional silane, an active hydrogen non-silane capping agent and a thermoplastic polymer.

Reactive hot melt adhesive having high initial strength, good heat stability and low monomeric diisocyanate

A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melt temperature of at least 70&#xb0; C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.

Hot melt adhesive composition

The invention features a hot melt adhesive composition that can be applied at temperatures as low as 107&#xb0; C., while maintaining excellent bonding under stress and a very fast setting time.

Low application temperature hot melt adhesive composition and a method including the same

A hot melt adhesive composition that includes at least 35% polymer, from about 15% by weight, to no greater than 75% by weight propylene polymer derived from at least 50% by weight propylene and from 0 mole % to about 37.5% by weight of an alpha-olefin comonomer other than propylene, the propylene polymer exhibiting a heat of fusion of from about 5 Joules per gram (J/g) to 60 J/g, from 5% by weight to about 50% by weight ethylene alpha-olefin copolymer derived from at least 50% by weight ethylene and at least one alpha-olefin comonomer having at least three carbon atoms, the ethylene alpha-olefin copolymer having a density of no greater than 0.90 g/cm, and from 18% by weight to about 37% by weight of a wax component that exhibits a melting point greater than 80&#xb0; C. and a heat of fusion of at least 200 J/g.

Propylene polymer-based hot melt adhesive composition exhibiting fast set time and articles including the same

A curable mixture is provided that is substantially free of volatile nonreactive compounds. Also provided is a method for making such curable mixtures, and a method of bonding substrates with such curable mixtures.

Michael addition compositions

Functional mixtures and polymer compositions are provided, each comprising at least one multi-functional Michael acceptor, at least one multi-functional Michael donor, in which at least 20% of either the donor or acceptor or a combination of the donor and acceptor is derived from bio-based materials and at least one catalyst.

Biomass based Michael addition compositions

A functional composition is provided that comprises at least one multi-functional Michael acceptor, at least one multi-functional Michael donor, and at least one weakly basic catalyst.

A functional mixture is provided that comprises at least one multi-functional Michael acceptor, at least one multi-functional Michael donor, and at least one weakly basic catalyst.

Disclosed are adhesives and processes for preparing the same, comprising at least one first homogeneous ethylene/&#x3b1;-olefin interpolymer, and optionally at least one tackifier, and optionally at least one plasticizer. The claimed adhesives are useful as adhesives such as are employed in various applications, such as in masking tape, clear office tape, labels, decals, bandages, decorative and protective sheets (such as shelf and drawer liners), floor tiles, sanitary napkin/incontinence device placement strips, sun control films, the joining of gaskets to automobile windows, packaging, bookbinding, construction of nonwoven articles, and insulation bonding.

Adhesives comprising olefin polymers

The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks

A method of preparing a cured laminate employing electron beam radiation is provided. The cured laminate is prepared from an uncured laminate including a prepolymer composition containing oligomer, tackifying resin, and optionally, monomer. Also provided are a prepolymer composition and an article including the cured laminate prepared by the method of this invention. The method is useful for preparing cured laminates such as flexible laminates for food packaging.

Method for preparing a laminate

Growing community of inventors

Woodbury, MN, United States of America

Thomas F Kauffman