San Jose, CA, United States of America

Thanh Nghia Tu

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.5

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2010-2013

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Innovations of Thanh Nghia Tu in MEMS Technology

Introduction

Thanh Nghia Tu is a notable inventor based in San Jose, CA, who has made significant contributions to the field of microelectromechanical systems (MEMS). With a total of 3 patents, his work focuses on improving the functionality and reliability of MEMS devices.

Latest Patents

One of his latest patents is titled "Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices." This invention provides methods for fabricating electromechanical systems that mitigate permanent adhesion, or stiction, of the moveable components. The methods utilize an amorphous silicon sacrificial layer that exhibits improved and reproducible surface roughness, ensuring excellent adhesion to common materials used in MEMS devices. Another significant patent is "Eliminate release etch attack by interface modification in sacrificial layers." This patent describes methods for creating MEMS devices by forming a sacrificial layer over a substrate and treating it to create a cavity, enhancing the overall performance of the device.

Career Highlights

Thanh Nghia Tu is currently employed at Qualcomm MEMS Technologies, Inc., where he continues to innovate and develop advanced MEMS solutions. His expertise in the field has positioned him as a key contributor to the company's research and development efforts.

Collaborations

Throughout his career, Thanh has collaborated with notable colleagues, including James Randolph Webster and Xiaoming Yan, further enhancing the impact of his work in the MEMS industry.

Conclusion

Thanh Nghia Tu's innovative patents and contributions to MEMS technology demonstrate his commitment to advancing the field. His work not only addresses critical challenges in device performance but also paves the way for future advancements in microelectromechanical systems.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…