Qualcomm Mems Technologies, Inc.

Thanh Nghia Tu

James Randolph Webster

Wonsuk Chung

Xiaoming Yan

Evgeni Petrovich Gousev

David Leslie Heald

Qi Luo

Chih-Wei Chiang

Chia Wei Yang

Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.

Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices

Methods of making a microelectromechanical system (MEMS) device are described. In some embodiments, the method includes forming a sacrificial layer over a substrate, treating at least a portion of the sacrificial layer to form a treated sacrificial portion, forming an overlying layer over at least a part of the treated sacrificial portion, and at least partially removing the treated sacrificial portion to form a cavity situated between the substrate and the overlying layer, the overlying layer being exposed to the cavity.

Eliminate release etch attack by interface modification in sacrificial layers

Growing community of inventors

San Jose, CA, United States of America

Thanh Nghia Tu