Company Filing History:
3 out of 10,346 
2 out of 29 
1 out of 80 
Years Active: 1994-1998
Title: Tetu Ohsawa: Innovator in Substrate Transfer Technology
Introduction
Tetu Ohsawa is a notable inventor based in Sagamihara, Japan. He has made significant contributions to the field of substrate transfer technology, holding a total of four patents. His work primarily focuses on improving the efficiency and effectiveness of wafer transfer processes in vertical heat treatment apparatuses.
Latest Patents
Ohsawa's latest patents include a substrate transfer apparatus and a method of transferring substrates. This innovative transfer apparatus is designed to facilitate the movement of wafers between a wafer carrier and a wafer boat. The apparatus consists of a base unit, a fork, three non-contact type sensors, and a main controller. The base unit is capable of moving between two positions: one for transferring the wafer to and from the wafer carrier and another for transferring it to and from the wafer boat. The fork is designed to move back and forth relative to the base unit to support the wafer during transfer. The non-contact type sensors, mounted on the fork, detect the position of the wafer, while the main controller manages the operations of the base unit and fork based on the sensor data. An alternative embodiment of the apparatus incorporates a monitor camera to track and display the fork's movement in relation to the wafer.
Career Highlights
Throughout his career, Tetu Ohsawa has worked with prominent companies in the semiconductor industry, including Tokyo Electron Limited and Tokyo Electron Tohoku Limited. His experience in these organizations has allowed him to refine his expertise in substrate transfer technologies and contribute to advancements in the field.
Collaborations
Ohsawa has collaborated with various professionals, including Kiyohisa Tateyama, to further enhance his innovative projects and patents.
Conclusion
Tetu Ohsawa's contributions to substrate transfer technology have made a significant impact in the semiconductor industry. His innovative patents and career achievements reflect his dedication to advancing technology in wafer processing.