This inventor holds 6 USPTO granted patents and 3 published patent applications. Top assignee: Kaneka Corporation. Active years: 2014-2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Shiga, JP (2017)
- Otsu, JP (2014 - 2021)
Company Filing History:
Years Active: 2014-2021
Title: Tetsuya Kogiso: Patent Contributions to Flexible Printed Wiring Materials.
Introduction
Tetsuya Kogiso is an inventor based in Otsu, Japan, whose patent work includes resin compositions and cured films for flexible printed wiring boards. He is associated with Kaneka Corporation and is named on 6 patents.
Latest Patents
Kogiso’s recent patent work includes “Thermosetting Resin Composition, Cured Film and Method for Producing Same, and Flexible Printed Board with Cured Film and Method for Producing Same.” The invention describes a thermosetting resin composition containing epoxy resin, a curing accelerator, a compound with a (meth)acryloyl group, and a high-molecular-weight compound with an acidic functional group. The composition can be used to form a cured film on a flexible printed wiring board and may include additional materials such as flame retardants or organic spherical beads.
Another recent patent is “Black Resin Composition, Polyimide with Black Resin Cured Film and Production Method Therefor, and Flexible Printed Wiring Board Using Black Resin Cured Film.” It describes forming a black resin cured film on polyimide, including a process that applies a specified spray impact. The patent also sets a dimensional requirement for the cured film’s top edge relative to its substrate-adhered edge.
Career Highlights
Kogiso’s listed inventions focus on materials and manufacturing methods for flexible printed wiring boards. His work addresses resin formulation, cured-film formation, and the production of black resin films on polyimide substrates. These technologies are associated with his work at Kaneka Corporation.
Collaborations
Kogiso’s named coworkers include Masayoshi Kido and Tomohiro Koda. Their shared patent-related work reflects collaboration in developing materials and processes for printed wiring board applications.
Conclusion
Tetsuya Kogiso’s patent portfolio highlights resin and cured-film innovations for flexible printed wiring boards, developed in connection with Kaneka Corporation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile