The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Jul. 08, 2011
Applicants:

Masayoshi Kido, Otsu, JP;

Tetsuya Kogiso, Otsu, JP;

Yoshihide Sekito, Otsu, JP;

Inventors:

Masayoshi Kido, Otsu, JP;

Tetsuya Kogiso, Otsu, JP;

Yoshihide Sekito, Otsu, JP;

Assignee:

Kaneka Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 3/00 (2006.01); C09J 163/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0058 (2013.01); H05K 1/189 (2013.01); C09J 163/00 (2013.01); H05K 1/0271 (2013.01);
Abstract

An object of the present invention is to provide (i) a stiffener-integrated flexible printed circuit board in which a defect such as a blistering is not generated during a reflow process even though a stiffener is attached to a photosensitive resin composition, and (ii) a method for manufacturing the stiffener-integrated flexible printed circuit board. The object can be attained by causing a stiffener-integrated flexible printed circuit board to have a structure in which (A) a stiffener (), (B) a bonding material (), (C) a cured film obtained by curing a photosensitive resin composition (), and (D) a flexible printed circuit board () are laminated in this order.


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