Kaneka Corporation

Tetsuya Kogiso

Yoshihide Sekito

Masayoshi Kido

Tomohiro Koda

Kan Fujihara

Yuji Asahina

A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.

Thermosetting resin composition, cured film and method for producing same, and flexible printed board with cured film and method for producing same

A production method for a polyimide with a black resin cured film includes a process of obtaining the black resin cured film by curing a black resin composition on the polyimide. The process of obtaining the black resin cured film includes a process of processing the black resin composition with a predetermined spray impact. A distance from a point where a line that is perpendicular to a surface of the polyimide and that passes through a substrate-adhered edge between the black resin cured film and the polyimide intersects a top portion of the black resin cured film to an edge of the top portion is 25 &#x3bc;m or less.

Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film

In order to provide (A) a photosensitive resin composition which (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing so as to have photosensitivity, (iii) prepares a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) has small warpage after being cured, (B) a resin film, (C) an insulating film, and (D) an printed wiring board provided with an insulating film, the photosensitive resin composition containing at least (A) binder polymer; (B) cross-linked polymer particles, whose polymer has a urethane bond in its molecule; (C) thermosetting resin; and (D) photo-polymerization initiator is used.

Photosensitive resin composition and use thereof

The object of the present invention is to provide a photosensitive resin composition which is excellent in: storage stability in a long-term storage; microfabricability; developability; low-temperature curability; flexibility in a cured film; electrical insulation reliability; solder heat resistance; resistance to an organic solvent; and flame retardancy and low in post-curing warpage when processed into a substrate. The object can be attained by use of a photosensitive resin composition production kit which includes at least two or more components including an A component and a B component. The A component contains a (A) compound having a carboxyl group. The B component contains a (B) compound having a reactive group which is reactive to a carboxyl group, a (C) oxime ester photopolymerization initiator, and a (D) compound having a photosensitive group but no carboxyl group.

Photosensitive resin composition production kit, and use thereof

An object of the present invention is to provide (i) a stiffener-integrated flexible printed circuit board in which a defect such as a blistering is not generated during a reflow process even though a stiffener is attached to a photosensitive resin composition, and (ii) a method for manufacturing the stiffener-integrated flexible printed circuit board. The object can be attained by causing a stiffener-integrated flexible printed circuit board to have a structure in which (A) a stiffener (), (B) a bonding material (), (C) a cured film obtained by curing a photosensitive resin composition (), and (D) a flexible printed circuit board () are laminated in this order.

Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate

An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250&#xb0; C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide a polyimide coating film obtained from the polyimide precursor composition and having good physical properties, and a method of producing the same. Furthermore, another object of the present invention is to provide a photosensitive resin composition containing the polyimide precursor composition, and a method of producing the same. These objects can be achieved by the polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure.

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Otsu, Japan

Tetsuya Kogiso