Location History:
- Niwa-gun, JP (2013 - 2014)
- Takahama, JP (2016)
Company Filing History:
Years Active: 2013-2016
Title: Tetsuo Suzuki: Innovator in Multilayer Wiring Technology
Introduction
Tetsuo Suzuki is a prominent inventor based in Niwa-gun, Japan. He has made significant contributions to the field of multilayer wiring technology, holding a total of 6 patents. His innovative approaches have advanced the manufacturing processes of wiring substrates, making them more efficient and effective.
Latest Patents
One of Tetsuo Suzuki's latest patents is a method of manufacturing a multi-layer wiring board. This method involves creating a first laminated structure with alternating conductor and resin insulating layers on a supporting substrate. A core substrate is then formed to contact the uppermost conductor layer, followed by the emission of laser light to create a through hole, into which a metal layer is formed. Additionally, a second laminated structure is formed on the core substrate, with specific thickness requirements for the conductor layers.
Another notable patent is related to the manufacturing of multilayer wiring substrates. In this patent, a resin insulation layer is designed with multiple openings on the bottom surface of a wiring laminate portion. Corresponding motherboard connection terminals, primarily made of copper, are strategically placed to align with these openings. A dissimilar metal layer is also incorporated to enhance the substrate's performance.
Career Highlights
Tetsuo Suzuki is currently employed at NGK Spark Plug Company, Limited, where he continues to innovate in the field of wiring technology. His work has not only contributed to the company's success but has also set new standards in the industry.
Collaborations
Throughout his career, Tetsuo has collaborated with notable colleagues such as Shinnosuke Maeda and Satoshi Hirano. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Tetsuo Suzuki's contributions to multilayer wiring technology exemplify the spirit of innovation. His patents reflect a deep understanding of manufacturing processes and a commitment to advancing the field. His work continues to influence the industry and inspire future inventors.