Osaka, Japan

Tetsuji Ishida

USPTO Granted Patents = 2 


Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Hirakata, JP (2014)
  • Osaka, JP (2018)

Company Filing History:


Years Active: 2014-2018

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2 patents (USPTO):Explore Patents

Title: Tetsuji Ishida: Innovator in Electroless Plating Technologies

Introduction

Tetsuji Ishida is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electroless plating, particularly through his innovative patents. With a total of 2 patents, Ishida's work has advanced the technology used in printed wiring boards and related applications.

Latest Patents

Ishida's latest patents include a pretreatment agent for electroless plating and a method for the pretreatment and production of printed wiring boards using the same. The pretreatment solution he developed exhibits unique properties due to the use of ampholytic surfactants, which demonstrate the characteristics of both anionic and cationic surfactants depending on the pH level. His catalyst application solution for plating insulating portions of objects is characterized by its composition, which includes a water-soluble palladium compound and a buffering agent, ensuring a simplified catalyst application process.

Career Highlights

Tetsuji Ishida is associated with C. Uyemura Co., Ltd., where he has been instrumental in developing advanced plating technologies. His work has not only simplified processes but also improved the efficiency and effectiveness of electroless plating methods.

Collaborations

Ishida has collaborated with notable coworkers such as Hisamitsu Yamamoto and Yoshikazu Saijo, contributing to the advancement of their shared field.

Conclusion

Tetsuji Ishida's innovative contributions to electroless plating technologies have made a significant impact in the industry. His patents reflect a deep understanding of chemical processes and their applications in modern technology.

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