Singapore, Singapore

Teck Tiong Tan


Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2007-2024

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4 patents (USPTO):Explore Patents

Title: **Innovator Profile: Teck Tiong Tan**

Introduction

Teck Tiong Tan is a prominent inventor based in Singapore, known for his contributions to the field of semiconductor technology. With four patents to his name, Tan has demonstrated his innovative spirit and expertise in developing advanced semiconductor devices.

Latest Patents

Teck Tiong Tan's most recent patents include a groundbreaking design for a "Semiconductor device and method of forming ultra high density embedded semiconductor die package." This innovative semiconductor device comprises a plurality of semiconductor dice, surrounded by a first prefabricated insulating film. This film encompasses glass cloth, glass fiber, or glass fillers, creating a robust environment for the semiconductor die. The design intricately involves a conductive layer and an interconnect structure, which enhances the performance and reliability of the semiconductor package. Notably, the first prefabricated insulating film covers both the first and side surfaces of the semiconductor die, ensuring optimum protection and integration.

Career Highlights

Tan has built an impressive career, having worked with notable companies such as Jcet Semiconductor (Shaoxing) Co., Ltd. and Delphi Technologies, Inc. His time at these organizations has allowed him to refine his skills in semiconductor manufacturing and innovation.

Collaborations

Throughout his career, Teck Tiong Tan has collaborated with talented colleagues, including See Chian Lim and Yung Kuan Hsiao. These partnerships have significantly contributed to his success and the innovative projects he has led in semiconductor development.

Conclusion

Teck Tiong Tan's work in the semiconductor industry showcases his commitment to innovation and excellence. With multiple patents and a successful career, he continues to influence the field and inspire future generations of inventors. His groundbreaking work, particularly in semiconductor packaging technology, exemplifies the potential of innovative thinking in addressing complex challenges in the tech industry.

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