The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2007

Filed:

Sep. 21, 2004
Applicants:

Teck Tiong Tan, Singapore, SG;

Binghua Pan, Singapore, SG;

Jeffrey H. Burns, Kokomo, IN (US);

John R. Troxell, Sterling Heights, MI (US);

Inventors:

Teck Tiong Tan, Singapore, SG;

Binghua Pan, Singapore, SG;

Jeffrey H. Burns, Kokomo, IN (US);

John R. Troxell, Sterling Heights, MI (US);

Assignee:

Delphi Technologies, Inc., Troy, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 5/02 (2006.01); H01L 31/203 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.


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