Company Filing History:
Years Active: 2005-2007
Title: Te-Sung Hung: Innovator in Chemical-Mechanical Polishing Technology
Introduction
Te-Sung Hung is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in chemical-mechanical polishing technology. With a total of 2 patents, his work has advanced the efficiency and effectiveness of semiconductor wafer processing.
Latest Patents
Te-Sung Hung's latest patents include a "Chemical-mechanical polishing apparatus and method of conditioning polishing pad." This invention features a comprehensive design that includes a polishing platen, polishing pad, slurry supplying piping, and a polishing pad conditioner. The apparatus is engineered to deliver slurry effectively to the polishing pad, enhancing the polishing process. Another significant patent is the "All-in-one polishing process for a semiconductor wafer." This process involves multiple steps, including surface chemical mechanical polishing and chemical cleaning, to ensure a smooth surface on semiconductor wafers.
Career Highlights
Te-Sung Hung is currently employed at United Microelectronics Corporation, where he applies his expertise in semiconductor technology. His innovative approaches have contributed to the company's advancements in wafer processing techniques.
Collaborations
Te-Sung has collaborated with several talented individuals, including Chi-Piao Cheng and Mu-Liang Liao, who have supported his research and development efforts in the field.
Conclusion
Te-Sung Hung's contributions to chemical-mechanical polishing technology have positioned him as a key figure in semiconductor manufacturing. His patents reflect a commitment to innovation and excellence in the industry.