The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Aug. 30, 2005
Sheng-yu Chen, Taichung County, TW;
Te-sung Hung, Hsinchu, TW;
Chung-jun Cheng, Hsinchu County, TW;
Chi-piao Cheng, Taipei, TW;
Po-yuan Cheng, Hsinchu, TW;
Sheng-Yu Chen, Taichung County, TW;
Te-Sung Hung, Hsinchu, TW;
Chung-Jun Cheng, Hsinchu County, TW;
Chi-Piao Cheng, Taipei, TW;
Po-Yuan Cheng, Hsinchu, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A chemical-mechanical polishing apparatus comprising at least a polishing platen, a polishing pad, a slurry supplying piping, a polishing pad conditioner, a chemical reagent supplying piping and a splitting piping is provided. The polishing platen has a plurality of slurry outlets disposed thereon and the polishing pad is disposed on the polishing platen. The slurry supplying piping is connected to the bottom of the polishing platen for delivering slurry to the surface of the polishing pad through the slurry outlets. The polishing pad conditioner is disposed over the polishing pad. The chemical reagent supplying piping is connected to the polishing pad conditioner for supplying the chemical reagent to the polishing conditioner. The splitting piping is connected between the slurry supplying piping and the chemical reagent supplying piping for providing chemical reagent to the surface of the polishing pad through the slurry supplying piping and the slurry outlets.