The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Jan. 16, 2004
Mu-liang Liao, Hsin-Chu Hsien, TW;
Chi-piao Cheng, Taipei, TW;
Te-sung Hung, Hsin-Chu, TW;
Yung-chieh Kuo, Taipei, TW;
Mu-Liang Liao, Hsin-Chu Hsien, TW;
Chi-Piao Cheng, Taipei, TW;
Te-Sung Hung, Hsin-Chu, TW;
Yung-Chieh Kuo, Taipei, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performed to polish and remove portions of the first material layer down to a first thickness, and a rim CMP process is performed to completely remove the second material layer on the edge bevel surface down to the edge bevel surface thereafter to achieve a smooth surface of the edge bevel surface. Finally, a chemical cleaning process is performed to clean the edge bevel surface and the top surface, and the semiconductor wafer is dried thereafter.