This inventor holds 3 USPTO granted patents and 10 published patent applications. Top assignee: Innolux Corporation. Active years: 2025-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025-2026
Title: Te-Hsun Lin: Innovator in Semiconductor Packaging Technology
Introduction
Te-Hsun Lin is a notable inventor based in Miao-Li County, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized for enhancing the efficiency and functionality of semiconductor devices.
Latest Patents
Te-Hsun Lin holds a patent for a semiconductor package device that features a unique configuration of metal lines. The patent, titled "Semiconductor package device having at least one second metal line between two adjacent first metal lines of redistribution layer," describes a semiconductor package that includes a chip and a redistribution layer. This layer is electrically connected to the chip and consists of multiple first and second metal lines. Notably, at least one of the second metal lines is positioned between two adjacent first metal lines, with a specific angle that optimizes performance. He has 1 patent to his name.
Career Highlights
Te-Hsun Lin is currently employed at Innolux Corporation, a leading company in the display technology sector. His role involves developing advanced semiconductor packaging solutions that are crucial for modern electronic devices. His innovative approach has contributed to the company's reputation for quality and reliability in the industry.
Collaborations
Throughout his career, Te-Hsun Lin has collaborated with talented colleagues, including Wen-Hsiang Liao and Mei-Yen Chen. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Te-Hsun Lin's contributions to semiconductor packaging technology exemplify his commitment to innovation and excellence. His patent and work at Innolux Corporation highlight his role as a key player in advancing the field. His collaborations with fellow professionals further enhance the impact of his inventions in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile