The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Dec. 22, 2022
Innolux Corporation, Miao-Li County, TW;
Te-Hsun Lin, Miao-Li County, TW;
Wen-Hsiang Liao, Miao-Li County, TW;
Mei-Yen Chen, Miao-Li County, TW;
Ming-Hsien Shih, Miao-Li County, TW;
Yung-Feng Chen, Miao-Li County, TW;
Cheng-Chi Wang, Miao-Li County, TW;
INNOLUX CORPORATION, Miao-Li County, TW;
Abstract
A semiconductor package device is provided. The semiconductor package device includes a chip and a redistribution layer disposed on the chip and electrically connected to the chip. The redistribution layer includes a plurality of first metal lines and a plurality of second metal lines, wherein at least one of the second metal lines is disposed between two adjacent first metal lines. The included angle between the at least one of the second metal lines and the two adjacent first metal lines is greater than or equal to 0 degrees and less than or equal to 10 degrees. The first width of one of the two adjacent first metal lines is greater than the second width of the at least one of the second metal lines.