Yung-Feng Chen

Title: Yung-Feng Chen: Innovator in Semiconductor Packaging

Introduction

Yung-Feng Chen is a notable inventor based in Miao-Li County, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and patents. His work is instrumental in advancing technology in this critical area.

Latest Patents

Yung-Feng Chen holds a patent for a semiconductor package device that features a unique configuration of metal lines. The patent describes a semiconductor package device that includes a chip and a redistribution layer electrically connected to the chip. This redistribution layer consists of multiple first metal lines and second metal lines, with at least one second metal line positioned between two adjacent first metal lines. The design ensures that the included angle between the second metal line and the adjacent first metal lines is between 0 and 10 degrees. This innovative approach enhances the efficiency and performance of semiconductor devices. He has 1 patent to his name.

Career Highlights

Yung-Feng Chen is currently employed at Innolux Corporation, where he continues to develop cutting-edge technologies in semiconductor packaging. His work at Innolux has positioned him as a key player in the industry, contributing to the company's reputation for innovation and quality.

Collaborations

Yung-Feng Chen collaborates with talented colleagues such as Te-Hsun Lin and Wen-Hsiang Liao. Together, they work on various projects that push the boundaries of semiconductor technology.

Conclusion

Yung-Feng Chen's contributions to semiconductor packaging through his innovative patent and work at Innolux Corporation highlight his importance in the field. His dedication to advancing technology continues to inspire future innovations in the industry.