The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Nov. 24, 2022
Applicant:

Innolux Corporation, Miaoli County, TW;

Inventors:

Tzu-Sheng Wu, Miaoli County, TW;

Haw-Kuen Liu, Miaoli County, TW;

Chung-Jyh Lin, Miaoli County, TW;

Cheng-Chi Wang, Miaoli County, TW;

Wen-Hsiang Liao, Miaoli County, TW;

Te-Hsun Lin, Miaoli County, TW;

Assignee:

Innolux Corporation, Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H01L 2224/034 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/17163 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01);
Abstract

The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.


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