Te-Chi Wong

Title: Innovations by Inventor Te-Chi Wong in Semiconductor Packaging

Introduction

Te-Chi Wong, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor packaging technology. With a total of two patents to his name, Wong is noted for his innovative approaches that enhance the functionality and efficiency of semiconductor packages.

Latest Patents

Wong's most recent patents involve a manufacturing method of a semiconductor package that includes a novel technique for forming a cavity in a circuit substrate without exposing the metal floor plate. The first patent offers a detailed description of a semiconductor package comprising a circuit substrate, a semiconductor die, and a filling material. The circuit substrate features a cavity that is concave from the first surface and incorporates a dielectric material with an embedded metal floor plate. This unique design ensures that the metal floor plate is electrically floating and isolated by the dielectric material, enhancing the reliability and performance of the semiconductor package. Additionally, the semiconductor die resides in the cavity and is electrically connected to the circuit substrate, while the filling material encapsulates the die, providing structural integrity.

Another patent that Te-Chi Wong holds mirrors the innovations described in the first. The focus remains on the semiconductor package, highlighting the advantages of combining a circuit substrate with a cavity, a dielectric material, and a semiconductor die. The implementation of an electrically isolated floor plate not only improves the package's efficacy but also represents a significant advancement in semiconductor technology.

Career Highlights

Te-Chi Wong is currently involved with Taiwan Semiconductor Manufacturing Company Ltd., a pivotal player in the global semiconductor industry. His position within the company enables him to leverage advanced research and development resources to propel innovative solutions in semiconductor packaging.

Collaborations

Wong collaborates with several esteemed professionals, including Meng-Liang Lin and Shuo-Mao Chen. These partnerships reflect a dynamic team environment where shared expertise contributes to groundbreaking advancements in technology.

Conclusion

In summary, Te-Chi Wong stands out as a prominent inventor in the semiconductor industry, with his patents significantly enhancing the current understanding and manufacturing capabilities of semiconductor packages. His ongoing work at Taiwan Semiconductor Manufacturing Company Ltd. and collaborations with talented colleagues underscore the importance of innovation in driving technological progress in this critical field.