Taiwan Semiconductor Manufacturing Comp. Ltd.

Te-Chi Wong

Shin-Puu Jeng

Shuo-Mao Chen

Po-Yao Chuang

Meng-Liang Lin

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.

Semiconductor package including a semiconductor die disposed in a cavity and method for manufacturing thereof

Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plate

Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavity

Growing community of inventors

Hsinchu, Taiwan

Te-Chi Wong