Company Filing History:
Years Active: 2010
Title: Te-Chen Feng: Innovator in High-Frequency Probing Technology
Introduction
Te-Chen Feng is a notable inventor based in Hsinchu Hsiang, Taiwan. He has made significant contributions to the field of probing technology, particularly in high-frequency applications. With a total of 2 patents, his work has advanced the capabilities of electronic testing.
Latest Patents
Te-Chen Feng's latest patents include a probing device and a high-frequency probe card. The probing device features a rack with an outer support member that supports a circuit layer and a center support member that supports a probe assembly. This design allows the outer support member to bear the touchdown stress when the tester makes contact with the circuit layer. Additionally, the center support member absorbs the reaction force from the IC wafer during testing. His high-frequency probe card consists of a circuit board with signal and grounding circuits, along with transmission lines that utilize a bi-wire structure. This innovative design ensures efficient transmission of high-frequency signals while maintaining characteristic impedance matching.
Career Highlights
Throughout his career, Te-Chen Feng has worked with reputable companies such as Mpi Corporation and Mjc Probe Inc. His experience in these organizations has contributed to his expertise in probing technology and electronic testing.
Collaborations
Te-Chen Feng has collaborated with talented individuals in his field, including Wei-Cheng Ku and Chih-Hao Ho. These partnerships have fostered innovation and development in high-frequency probing solutions.
Conclusion
Te-Chen Feng's contributions to probing technology, particularly in high-frequency applications, have established him as a key figure in the industry. His patents reflect a commitment to advancing electronic testing methods, making a lasting impact on the field.