For the Inventor, By the Inventor

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Hsinchu, Taiwan

Mpi Corporation

USPTO Granted Patents = 153

% Expired Patents = 28.1

EPO Patents = 5

Trademarks = 6

Forward Citations = 216

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206 inventors (with patents filed for the assignee):

Wei-Cheng Ku (33 out of 38 patents)

Tsung-Yi Chen (18 out of 18 patents)

Chih-Hao Ho (16 out of 18 patents)

4. Hao Wei (14 out of 14 patents)

5. Jun-Liang Lai (12 out of 14 patents)

6. Chien-Chou Wu (11 out of 11 patents)

7. Chien-Hung Chen (11 out of 119 patents)

8. Che-Wei Lin (10 out of 11 patents)

9. Yu-Hsun Hsu (10 out of 10 patents)

10. Stojan Kanev (10 out of 10 patents)

11. Chung-Tse Lee (10 out of 10 patents)

12. Chia-Tai Chang (10 out of 10 patents)

13. Horng-Kuang Fan (9 out of 11 patents)

14. Chin-Yi Lin (8 out of 10 patents)

15. Lin-Lin Chih (8 out of 8 patents)

Core Competencies:

Probe Card

Wafer Inspection

Optical Detection

Testing Systems

Motorized Chuck

Temperature Control

Impedance Testing

High Frequency Signals

Probe Assembly

Circuit Board Detection

Packaging Apparatus

Medical Examination

153 patents: Sort by Forward Citations

1. 12768861 - Adhered multilayer die unit and probe head, probe seat, probe card and test system including the same (2026-10-20),

2. 12761271 - Method for adjusting the position of probing base and probing machine using the same (2026-10-13),

3. 12761245 - Vertical probe, probe head and method of making the vertical probe (2026-10-13),

4. 12724042 - Positioning method and probe system for performing the same, method for operating probe system, and method for utilizing probe system to produce a tested semiconductor device (2026-09-01),

5. 12710449 - PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMICONDUCTOR WAFER, AND PROBE CARD, PROBE HEAD, AND GUIDING PLATE STRUCTURE THEREIN (2026-08-18),

6. 12693312 - Quick coupling probe head (2026-07-28),

7. 12571834 - Circuit board detection device (2026-03-10),

8. 12480976 - Probe card and manufacturing method thereof (2025-11-25),

9. 12392803 - Probe card, method for designing probe card, method for producing tested semiconductor device method for testing unpackaged semiconductor by probe card, device under test and probe system (2025-08-19),

10. 12319024 - Packaging apparatus, system, and method for forming filled cones (2025-06-03),

11. 12196808 - Motorized chuck stage controlling method (2025-01-14),

12. 12196779 - Probe system and machine apparatus thereof (2025-01-14),

13. 12158493 - Wafer inspection system and annular seat thereof (2024-12-03),

14. 12099078 - Probe card and wafer testing assembly thereof (2024-09-24),

15. 12092658 - Optical detection system and alignment method for a predetermined target object (2024-09-17),

Company Overview

Mpi Corporation, headquartered in Hsinchu, Taiwan, specializes in advanced probe card technology essential for semiconductor testing. The company focuses on developing innovative solutions for wafer inspection and optical detection, enhancing the efficiency and accuracy of testing systems. Their expertise extends to motorized chuck systems, temperature control mechanisms, and impedance testing, catering to high-frequency signal applications. Mpi Corporation plays a crucial role in the semiconductor industry by providing cutting-edge tools that support the rigorous demands of modern electronic testing.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

153 Patents

#50 in Hsinchu

#166 in Taiwan

#5,343 in the World

Hsinchu, Taiwan

Mpi Corporation

Forward Citations = 216

206 inventors:

Wei-Cheng Ku (33 out of 38 patents)

Tsung-Yi Chen (18 out of 18 patents)

Chih-Hao Ho (16 out of 18 patents)

4. Hao Wei (14 out of 14 patents)

5. Jun-Liang Lai (12 out of 14 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Mpi Corporation. Retrieved from https://idiyas.com/company/mpi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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