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For the Inventor, By the Inventor

Hsinchu, Taiwan

Mpi Corporation


USPTO Granted Patents = 150

% Expired Patents = 28.7


Trademarks = 6

Forward Citations = 216

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202 inventors (with patents filed for the assignee):

goldMedal Wei-Cheng Ku (33 out of 38 patents)

silverMedal Tsung-Yi Chen (18 out of 18 patents)

bronzeMedal Chih-Hao Ho (16 out of 18 patents)

4.  Hao Wei (14 out of 14 patents)

5.  Jun-Liang Lai (12 out of 14 patents)

6.  Chien-Chou Wu (11 out of 11 patents)

7.  Chien-Hung Chen (11 out of 119 patents)

8.  Che-Wei Lin (10 out of 11 patents)

9.  Yu-Hsun Hsu (10 out of 10 patents)

10.  Stojan Kanev (10 out of 10 patents)

11.  Chung-Tse Lee (10 out of 10 patents)

12.  Chia-Tai Chang (10 out of 10 patents)

13.  Horng-Kuang Fan (9 out of 11 patents)

14.  Chin-Yi Lin (8 out of 10 patents)

15.  Lin-Lin Chih (8 out of 8 patents)


Core Competencies:
Probe Card
Wafer Inspection
Optical Detection
Testing Systems
Motorized Chuck
Temperature Control
Impedance Testing
High Frequency Signals
Probe Assembly
Circuit Board Detection
Packaging Apparatus
Medical Examination

150 patents:

1. 12724042 - Positioning method and probe system for performing the same, method for operating probe system, and method for utilizing probe system to produce a tested semiconductor device (2026-09-01),
2. 12710449 - PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMICONDUCTOR WAFER, AND PROBE CARD, PROBE HEAD, AND GUIDING PLATE STRUCTURE THEREIN (2026-08-18),
3. 12693312 - Quick coupling probe head (2026-07-28),
4. 12571834 - Circuit board detection device (2026-03-10),
5. 12480976 - Probe card and manufacturing method thereof (2025-11-25),
6. 12392803 - Probe card, method for designing probe card, method for producing tested semiconductor device method for testing unpackaged semiconductor by probe card, device under test and probe system (2025-08-19),
7. 12319024 - Packaging apparatus, system, and method for forming filled cones (2025-06-03),
8. 12196808 - Motorized chuck stage controlling method (2025-01-14),
9. 12196779 - Probe system and machine apparatus thereof (2025-01-14),
10. 12158493 - Wafer inspection system and annular seat thereof (2024-12-03),
11. 12099078 - Probe card and wafer testing assembly thereof (2024-09-24),
12. 12092658 - Optical detection system and alignment method for a predetermined target object (2024-09-17),
13. 12050235 - Heat dissipatable die unit and probe seat using the same (2024-07-30),
14. 12025637 - Probe card (2024-07-02),
15. D1031738 - Die plate assembly for probe head (2024-06-18),
Mpi Corporation, headquartered in Hsinchu, Taiwan, specializes in advanced probe card technology essential for semiconductor testing. The company focuses on developing innovative solutions for wafer inspection and optical detection, enhancing the efficiency and accuracy of testing systems. Their expertise extends to motorized chuck systems, temperature control mechanisms, and impedance testing, catering to high-frequency signal applications. Mpi Corporation plays a crucial role in the semiconductor industry by providing cutting-edge tools that support the rigorous demands of modern electronic testing.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

Mpi Corporation
150 Patents

#51 in Hsinchu

#168 in Taiwan

#5,434 in the World

Hsinchu, TW
Hsinchu, Taiwan

Mpi Corporation

Forward Citations = 216

202 inventors:

goldMedal Wei-Cheng Ku (33 out of 38 patents)

silverMedal Tsung-Yi Chen (18 out of 18 patents)

bronzeMedal Chih-Hao Ho (16 out of 18 patents)

4.  Hao Wei (14 out of 14 patents)

5.  Jun-Liang Lai (12 out of 14 patents)

Please report any incorrect information to [email protected]
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