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For the Inventor, By the Inventor

Hsinchu County, Taiwan

Mpi Corporation


USPTO Granted Patents = 145


Trademarks = 7

Forward Citations = 204

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189 inventors (with patents filed for the assignee):

goldMedal Wei-Cheng Ku (33 out of 38 patents)

silverMedal Tsung-Yi Chen (18 out of 18 patents)

bronzeMedal Chih-Hao Ho (16 out of 18 patents)

4.  Hao Wei (14 out of 14 patents)

5.  Jun-Liang Lai (12 out of 14 patents)

6.  Chien-Chou Wu (11 out of 11 patents)

7.  Che-Wei Lin (10 out of 11 patents)

8.  Chung-Tse Lee (10 out of 10 patents)

9.  Chia-Tai Chang (10 out of 10 patents)

10.  Chien-Hung Chen (10 out of 116 patents)

11.  Yu-Hsun Hsu (9 out of 9 patents)

12.  Stojan Kanev (9 out of 9 patents)

13.  Horng-Kuang Fan (9 out of 11 patents)

14.  Chin-Yi Lin (8 out of 10 patents)

15.  Tien-Chia Li (8 out of 9 patents)


Core Competencies:
Probe Card
Wafer Inspection System
Optical Detection System
Motorized Chuck Stage
Probe Assembly
Image Processing
High Frequency Signal Test
Light Emitting Device
Packaging Apparatus
Probe Head
Temperature Compensation
Touch Display Control

145 patents:

1. 12480976 - Probe card and manufacturing method thereof (2025-11-25),
2. 12392803 - Probe card, method for designing probe card, method for producing tested semiconductor device method for testing unpackaged semiconductor by probe card, device under test and probe system (2025-08-19),
3. 12196808 - Motorized chuck stage controlling method (2025-01-14),
4. 12196779 - Probe system and machine apparatus thereof (2025-01-14),
5. 12158493 - Wafer inspection system and annular seat thereof (2024-12-03),
6. 12099078 - Probe card and wafer testing assembly thereof (2024-09-24),
7. 12092658 - Optical detection system and alignment method for a predetermined target object (2024-09-17),
8. 12050235 - Heat dissipatable die unit and probe seat using the same (2024-07-30),
9. 12025637 - Probe card (2024-07-02),
10. D1031738 - Die plate assembly for probe head (2024-06-18),
11. 12007319 - Optical path correction subassembly, optical detection assembly, and optical detection system (2024-06-11),
12. 11906571 - Optical detection system and laser light providing module without using an optical fiber (2024-02-20),
13. 11874313 - Probe card and manufacturing method thereof (2024-01-16),
14. 11852679 - Circuit board for semiconductor test (2023-12-26),
15. 11839020 - Trace embedded probe device (2023-12-05),
MPI Corporation is a leading provider of advanced wafer probing solutions for the global semiconductor industry. With over 20 years of experience, we offer a comprehensive range of products and services that cater to the needs of semiconductor manufacturers. Our cutting-edge solutions enable accurate and efficient testing of semiconductor wafers, improving overall production yield and reducing time-to-market. Visit our website to learn more about our innovative offerings and how we can help accelerate your semiconductor testing processes.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 23 2025

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145 Patents

#3 in Hsinchu County

#164 in Taiwan

#5,467 in the World

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Hsinchu County, Taiwan

Mpi Corporation

Forward Citations = 204

189 inventors:

goldMedal Wei-Cheng Ku (33 out of 38 patents)

silverMedal Tsung-Yi Chen (18 out of 18 patents)

bronzeMedal Chih-Hao Ho (16 out of 18 patents)

4.  Hao Wei (14 out of 14 patents)

5.  Jun-Liang Lai (12 out of 14 patents)

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