The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Jun. 04, 2008
Wei-cheng Ku, Hsinchu Hsiang, TW;
Chih-hao Ho, Hsinchu Hsiang, TW;
Ho-hui Lin, Hsinchu Hsiang, TW;
Te-chen Feng, Hsinchu Hsiang, TW;
Jun-liang Lai, Hsinchu Hsiang, TW;
Jia-chi Ho, Hsinchu Hsiang, TW;
Chih-chung Chien, Hsinchu Hsiang, TW;
Chien-huei Huang, Hsinchu Hsiang, TW;
Ai-chuan Chang, Hsinchu Hsiang, TW;
Horng-chuan Sun, Hsinchu Hsiang, TW;
Wei-Cheng Ku, Hsinchu Hsiang, TW;
Chih-Hao Ho, Hsinchu Hsiang, TW;
Ho-Hui Lin, Hsinchu Hsiang, TW;
Te-Chen Feng, Hsinchu Hsiang, TW;
Jun-Liang Lai, Hsinchu Hsiang, TW;
Jia-Chi Ho, Hsinchu Hsiang, TW;
Chih-Chung Chien, Hsinchu Hsiang, TW;
Chien-Huei Huang, Hsinchu Hsiang, TW;
Ai-Chuan Chang, Hsinchu Hsiang, TW;
Horng-Chuan Sun, Hsinchu Hsiang, TW;
MJC Probe Incorporated, Hsinchu Hsiang, TW;
Abstract
A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.