The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Oct. 20, 2006
Wei-cheng Ku, Hsinchu Hsiang, TW;
Hsin-hung Lin, Hsinchu Hsiang, TW;
Chih-hao Ho, Hsinchu Hsiang, TW;
Te-chen Feng, Hsinchu Hsiang, TW;
Wei-Cheng Ku, Hsinchu Hsiang, TW;
Hsin-Hung Lin, Hsinchu Hsiang, TW;
Chih-Hao Ho, Hsinchu Hsiang, TW;
Te-Chen Feng, Hsinchu Hsiang, TW;
MPI Corporation, Chu-Pei, Hsinchu Shien, TW;
Abstract
A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.