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For the Inventor, By the Inventor

Osaka, Japan

Tatsuya Okuno

USPTO Granted Patents = 22 

 

Average Co-Inventor Count = 2.4

ph-index = 5

Forward Citations = 90(Granted Patents)


Location History:

  • Otsu, JP (1988 - 1992)
  • Kurita, JP (1999)
  • Kurita-gun, JP (2000 - 2005)
  • Takatsuki, JP (2008 - 2019)
  • Osaka, JP (2011 - 2024)

Company Filing History:

goldMedal10 out of 13,289 
 
Panasonic Intellectual Property Management Co., Ltd.
 patents
silverMedal9 out of 88 
 
Sunstar Giken Kabushiki Kaisha
 patents
bronzeMedal2 out of 3,870 
 
Nitto-denko Corporation
 patents
4. 1 out of 44 
 
Sunstar Suisse S.a.
 patents
5. 1 out of 76 
 
Sunstar Engineering Pte. Ltd.
 patents
6. 1 out of 832,843 
Other
 patents
where one patent can have more than one assignee

Years Active: 1988-2024

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22 patents (USPTO):Explore Patents
1. 11898343 - Water-repellent member, and building member and wet room member using same (2024-02-13),
2. 11435059 - Wavelength conversion member and white light emitting device using same (2022-09-06),
3. 11384920 - Illumination device (2022-07-12),
4. 11371675 - Light emitting device (2022-06-28),
5. 11131914 - Wavelength conversion member (2021-09-28),
6. 10836958 - Wavelength conversion member (2020-11-17),
7. 10651348 - Light emitting device (2020-05-12),
8. 10355175 - Light emitting device (2019-07-16),
9. 10189937 - Fine powder-coated amine and composition containing same (2019-01-29),
10. 9774010 - Light reflective material and light-emitting device (2017-09-26),
11. 9640783 - Light emitting device with reflective layer including filler particles (2017-05-02),
12. 8277897 - Reactive polymer-supporting porous film for battery separator and use thereof (2012-10-02),
13. 8062387 - Reactive polymer-supporting porous film for battery separator and use thereof (2011-11-22),
14. 7449362 - One-component hot-setting epoxy resin composition and semiconductor mounting underfill material (2008-11-11),
15. 6881591 - Underfilling material for semiconductor package (2005-04-19),

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