The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2008
Filed:
Mar. 29, 2002
Johshi Gotoh, Takatsuki, JP;
Tatsuya Okuno, Takatsuki, JP;
Johshi Gotoh, Takatsuki, JP;
Tatsuya Okuno, Takatsuki, JP;
Sunstar Giken Kabushiki Kaisha, Osaka-fu, JP;
Abstract
The present invention provides an one-pack thermosetting type epoxy resin composition which is useful as an underfilling material used when a flip chip or a semiconductor package comprised of a semiconductor element held on a carrier base being mounted onto a wiring substrate; which can omit a fluxing process as adopted for improvement of the bonding force of bumps or solder balls particularly at said mounting and exhibits a good voidless property even at a reflow temperature; and which can be also applied as an adhesive, a paint, a coating material, a sealing material, or the like. The one-pack thermosetting type epoxy resin composition of the present invention comprises as essential ingredients, a liquid epoxy resin and a carboxylic acid having two or more carboxylic groups in molecule as a curing agent.