Company Filing History:
Years Active: 2004-2008
Title: Tatsuya Ogino: Innovator in High-Frequency Module Technology
Introduction
Tatsuya Ogino is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of high-frequency technology, holding a total of 4 patents. His work primarily focuses on the development of high-frequency module board devices that enhance signal modulation and demodulation.
Latest Patents
Ogino's latest patents include a high-frequency module board device and a high-frequency module with a manufacturing method. The high-frequency module board device features a high-frequency transmitting and receiving circuit designed to modulate and demodulate high-frequency signals. This invention includes a base board with a build-up surface and a high-frequency circuit part that incorporates passive elements. The design reduces parasitic capacitance, thereby improving the performance characteristics of the capacitance.
The second patent, a high-frequency module device, integrates a distributed constant circuit. This device consists of a base board with a high-frequency element layer forming surface, which is created through flattening processing. The high-frequency element layer part includes passive and circuit elements that facilitate the reception of power or signals from the base board.
Career Highlights
Tatsuya Ogino is currently employed at Sony Corporation, where he continues to innovate in the field of high-frequency technology. His work has been instrumental in advancing the capabilities of high-frequency modules, making them more efficient and effective.
Collaborations
Ogino has collaborated with notable coworkers, including Takahiko Kosemura and Akihiko Okubora. Their combined expertise has contributed to the successful development of high-frequency technologies.
Conclusion
Tatsuya Ogino's contributions to high-frequency technology through his patents and work at Sony Corporation highlight his role as a leading inventor in this field. His innovations continue to shape the future of high-frequency module devices.