The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2004
Filed:
Jan. 03, 2003
Takahiko Kosemura, Kanagawa, JP;
Akihiko Okubora, Kanagawa, JP;
Takayuki Hirabayashi, Tokyo, JP;
Tatsuya Ogino, Kanagawa, JP;
Kuniyuki Hayashi, Oita, JP;
Sony Corporation, Tokyo, JP;
Abstract
The present invention provides a high-frequency module configuring a micro communication functional module, which includes a base substrate ( ) which has multiple pattern wiring layers ( ) ( ) ( ) ( ) and dielectric insulating layers ( ) ( ) ( ) formed therein, and has a buildup surface for smoothing the upper layer thereof, and a high-frequency element layer ( ) formed on the buildup surface, which has an inductor ( ) formed therein via an insulating layer ( ) formed on the buildup surface. The base substrate ( ) is provided with a region ( ) where the pattern wiring layers ( ) ( ) ( ) ( ) are not formed from the upper layer to at least the mid portion thereof along the thickness direction, and the inductor ( ) of the high-frequency element layer ( ) is formed directly above the region ( ).