This inventor holds 1 USPTO granted patent. Top assignee: Disco Corporation. Active years: 2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009
Title: Tatsuya Inaoka: Innovator in Wafer Technology
Introduction
Tatsuya Inaoka is a prominent inventor based in Tokyo, Japan. He is known for his contributions to the field of semiconductor technology, particularly in wafer processing methods. His innovative approach has led to advancements that enhance the efficiency and precision of wafer division.
Latest Patents
Tatsuya Inaoka holds a patent for a "Wafer dividing method and wafer dividing apparatus." This invention involves a method of dividing a wafer along lattice pattern-like dividing lines. The process includes a frame holding step, a wafer cooling step, and a dividing step that utilizes adhesive tape to facilitate the division of the wafer. He has 1 patent to his name, showcasing his expertise in this specialized area.
Career Highlights
Inaoka is currently employed at Disco Corporation, a company recognized for its innovations in semiconductor manufacturing equipment. His work at Disco Corporation has allowed him to apply his inventive skills in a practical setting, contributing to the company's reputation for excellence in the industry.
Collaborations
Throughout his career, Tatsuya Inaoka has collaborated with notable colleagues, including Koichi Mitani and Masaru Nakamura. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Tatsuya Inaoka's contributions to wafer technology exemplify the impact of innovation in the semiconductor industry. His patent and work at Disco Corporation highlight his role as a key figure in advancing wafer processing methods.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile