The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2009
Filed:
Jan. 08, 2007
Yosuke Watanabe, Tokyo, JP;
Keiji Nomaru, Tokyo, JP;
Nobumori Ogoshi, Tokyo, JP;
Koichi Mitani, Tokyo, JP;
Taizo Kise, Tokyo, JP;
Kohei Matsumoto, Tokyo, JP;
Tatsuya Inaoka, Tokyo, JP;
Masaru Nakamura, Tokyo, JP;
Yosuke Watanabe, Tokyo, JP;
Keiji Nomaru, Tokyo, JP;
Nobumori Ogoshi, Tokyo, JP;
Koichi Mitani, Tokyo, JP;
Taizo Kise, Tokyo, JP;
Kohei Matsumoto, Tokyo, JP;
Tatsuya Inaoka, Tokyo, JP;
Masaru Nakamura, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.