Company Filing History:
Years Active: 2009
Title: Taizo Kise: Innovator in Wafer Technology
Introduction
Taizo Kise is a prominent inventor based in Tokyo, Japan. He is known for his contributions to the field of wafer technology, particularly in methods that enhance the efficiency of wafer processing.
Latest Patents
Kise holds a patent for a "Wafer dividing method and wafer dividing apparatus." This innovative method involves dividing a wafer along lattice pattern-like dividing lines. The process includes a frame holding step, a wafer cooling step, and a dividing step that utilizes adhesive tape to facilitate the division of the wafer.
Career Highlights
Taizo Kise is associated with Disco Corporation, where he applies his expertise in wafer technology. His work has significantly impacted the efficiency of wafer processing in the semiconductor industry.
Collaborations
Kise collaborates with notable colleagues such as Yosuke Watanabe and Keiji Nomaru, contributing to advancements in their field.
Conclusion
Taizo Kise's innovative approach to wafer technology exemplifies the importance of continuous improvement in manufacturing processes. His contributions are vital to the advancement of semiconductor technology.