Tapan Ganpule

Title: Tapan Ganpule: Inventor in Chiplet Validation

Introduction

Tapan Ganpule is an inventor based in Folsom, California, and works at Intel Corporation. His patent work addresses methods for validating graphics processor dies in multi-die systems.

Latest Patents

Ganpule is associated with 1 patent, titled “FPGA Based Platform for Post-Silicon Validation of Chiplets.” The invention describes an apparatus that connects a graphics processor die to an active interposer and circuit board through a debug package. An FPGA is configured to emulate functionality assigned to another die in a multi-die system-on-chip, allowing the graphics processor die to be validated separately from the other dies.

Career Highlights

The patent highlights Ganpule’s work on post-silicon validation and FPGA-based emulation for chiplet architectures. This approach can support testing of a graphics processor die before the complete multi-die system is assembled.

Collaborations

Rakesh Mehta and Hanmanthrao Patli are identified as Ganpule’s coworkers. The patent’s technical focus reflects collaborative engineering work on validation platforms for multi-die systems.

Conclusion

Tapan Ganpule’s patent contribution centers on using FPGA emulation to enable separate validation of graphics processor dies in chiplet-based systems.