The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Jun. 14, 2022
Intel Corporation, Santa Clara, CA (US);
Rakesh Mehta, San Jose, CA (US);
Hanmanthrao Patli, Folsom, CA (US);
Ivan Herrera Mejia, El Dorado Hills, CA (US);
Raj Chandar Rasappan, Folsom, CA (US);
Hagay Spector, Sderot, IL;
Renu Patle, Folsom, CA (US);
Fylur Rahman Sathakathulla, Folsom, CA (US);
Ruchira Liyanage, Folsom, CA (US);
Raju Kasturi, Folsom, CA (US);
Fred Steinberg, Paradise Valley, AZ (US);
Ananth Gopalakrishnan, Folsom, CA (US);
Satish Venkatesan, San Jose, CA (US);
Pradyumna Reddy Patnam, Chandler, AZ (US);
Suresh Pothukuchi, Chandler, AZ (US);
Tapan Ganpule, Folsom, CA (US);
Atthar H. Mohammed, Folsom, CA (US);
Altug Koker, El Dorado Hills, CA (US);
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
One embodiment provides an apparatus comprising a circuit board; an active interposer coupled with the circuit board via a debug package, and a graphics processor die coupled with the active interposer via the debug package. The graphics processor die includes graphics processor resources configured to execute instructions for a multi-die system on chip (SoC) device and excludes functionality that is implemented in a separate die of the multi-die SoC. The apparatus includes a field-programmable gate array (FPGA) including hardware logic that is configurable to emulate functionality provided by the separate die of the multi-die SoC device, which enables silicon validation of the graphics processor die separately from other dies of the multi-die SoC.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile