Beijing, China

Tao Zhou

USPTO Granted Patents = 22 

Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:

goldMedal6 out of 3,046 
 
Future Wei Technologies, Inc.
 patents
silverMedal3 out of 30 
 
Bitmain Technologies Limited
 patents
bronzeMedal2 out of 343 
 
Chongqing Boe Optoelectronics Technology Co., Ltd.
 patents
42 out of 18,140 
 
Boe Technology Group Co., Ltd.
 patents
52 out of 164,108 
 
International Business Machines Corporation
 patents
62 out of 116 
 
University of Science and Technology Beijing
 patents
72 out of 7 
 
North China Institute of Science and Technology
 patents
82 out of 2 
 
Biomedical Analysis Center, Academy of Military Medical Sciences
 patents
92 out of 2 
 
Institute of Pharmacology and Toxicology, Academy of Military Medical Sciences
 patents
101 out of 1 
 
Beijing Anke Technology Co., Ltd.
 patent
111 out of 1 
 
Beijing Anke Xingye Science and Technology Co., Ltd.
 patent
121 out of 1 
 
Biomedical Anaylsis Center, Academy of Military Medical Sciences
 patent
131 out of 9 
 
Beijing Sifang Automation Co., Ltd.
 patents
141 out of 729 
 
Sony Mobile Communications Inc.
 patents
151 out of 1 
 
Biomedical Analysis Center of Academy of Military Medical Sciences
 patent
161 out of 67 
 
Beijing Volcano Engine Technology Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2009-2025

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):

Title: **Tao Zhou: Pioneering Innovations in Chip Technology**

Introduction

Tao Zhou is an accomplished inventor based in Beijing, China, renowned for his contributions to the field of chip technology. With a remarkable portfolio of 20 patents, he has become a prominent figure in developing advanced heat dissipation solutions for high-performance chips. His inventive prowess has been pivotal in addressing significant challenges in electronic design and manufacturing.

Latest Patents

Among his latest patents are groundbreaking innovations including a chip heat dissipating structure, a chip structure, a circuit board, and a supercomputing device. The chip heat dissipating structure features a multi-layer plating system covering the chip, incorporating a first, second, and third metal layer arranged in sequence. This innovative design allows for superior thermal conductivity and enhances heat dissipation efficiency by enabling a heat sink to be securely attached via a solder layer that primarily consists of metal tin. This groundbreaking approach effectively resolves the heat dissipation bottleneck associated with traditional resin materials used in chips, resulting in significant improvements in the performance and longevity of electronic devices.

Career Highlights

Tao has had an impressive career, having worked with notable organizations in the tech industry. His experience includes significant roles at Future Wei Technologies, Inc. and Chongqing Boe Optoelectronics Technology Co., Ltd. Through his roles in these companies, he has been instrumental in the development of cutting-edge technologies that have pushed the boundaries of chip design and manufacturing.

Collaborations

Throughout his career, Tao Zhou has collaborated with esteemed colleagues in the industry, including Ying Chen and Qianglin Quintin Zhao. These partnerships have fostered a collaborative environment that inspires innovation and allows for the sharing of expertise that enhances project outcomes.

Conclusion

Tao Zhou exemplifies the spirit of innovation in the realm of chip technology. His contributions through numerous patents not only mark significant advancements in the field but also reflect his commitment to overcoming the challenges that modern electronics face. As technology continues to evolve, inventors like Tao will undoubtedly play a crucial role in shaping the future of high-performance computing and electronic design.

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