Shirakawa, Japan

Takuya Sasaki

This inventor holds 4 USPTO granted patents and 1 EPO patent. Top assignee: Shin-Etsu Handotai Co., Ltd.. Active years: 2016-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takuya Sasaki. Retrieved from https://idiyas.com/inventor/takuya-sasaki-al52wfsm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 3.5

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Nishishirakawa, JP (2016)
  • Shirakawa, JP (2019 - 2020)

Company Filing History:


Years Active: 2016-2020

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4 patents (USPTO):Explore Patents

Title: Takuya Sasaki: Innovator in Polishing Technology

Introduction

Takuya Sasaki is a prominent inventor based in Shirakawa, Japan. He has made significant contributions to the field of polishing technology, particularly in the semiconductor industry. With a total of 4 patents to his name, Sasaki's work focuses on improving the efficiency and effectiveness of polishing processes.

Latest Patents

Sasaki's latest patents include innovative methods that enhance the performance of polishing pads used in semiconductor manufacturing. One notable patent is a "Method for Conditioning Polishing Pad and Polishing Apparatus." This method involves conditioning a polishing pad attached to a rotatable discoid turntable using a conditioning head. The process is characterized by moving the conditioning head radially while controlling the rotational speed of the turntable and the moving speed of the conditioning head. This approach ensures that the entire polishing surface of the pad is appropriately conditioned.

Another significant patent is the "Method for Raising Polishing Pad and Polishing Method." This method focuses on a polishing pad made of foamed urethane resin. After dressing and dummy polishing, the method measures the amount of polishing residues in the pad to determine the rise of the polishing pad. This innovation aims to improve the particle level in the polishing pad during its early life stage.

Career Highlights

Sasaki is currently employed at Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor materials industry. His work at the company has allowed him to develop and refine his innovative polishing techniques, contributing to advancements in semiconductor manufacturing.

Collaborations

Throughout his career, Takuya Sasaki has collaborated with talented individuals such as Yuki Tanaka and Taichi Yasuda. These collaborations have fostered a creative environment that has led to the development of groundbreaking polishing technologies.

Conclusion

Takuya Sasaki's contributions to polishing technology have made a significant impact on the semiconductor industry. His innovative methods and dedication to improving polishing processes continue to influence the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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