Company Filing History:
Years Active: 2016-2018
Title: Takuya Komeda: Innovator in Electroless Plating Technologies
Introduction
Takuya Komeda is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electroless plating and printed wiring board production. With a total of 2 patents to his name, Komeda's work showcases his expertise and innovative spirit.
Latest Patents
Komeda's latest patents include a pretreatment agent for electroless plating and a method for the pretreatment and production of printed wiring boards using the same. His research on ampholytic surfactants reveals their dual nature, acting as anionic surfactants in alkaline conditions and cationic surfactants in acidic environments. The pretreatment solution he developed is characterized by a pH of 8.5 or higher, enhancing its effectiveness in various applications. Additionally, his pretreatment agent incorporates a fluorine compound, surfactants, and specific solvents, providing a comprehensive solution for substrate preparation in printed wiring board production.
Career Highlights
Takuya Komeda is associated with C. Uyemura Co., Ltd., where he continues to advance his research and development efforts. His work has been instrumental in improving the efficiency and effectiveness of electroless plating processes.
Collaborations
Komeda collaborates with esteemed colleagues such as Yoshikazu Saijo and Hisamitsu Yamamoto. Their combined expertise fosters innovation and drives advancements in their respective fields.
Conclusion
Takuya Komeda's contributions to electroless plating and printed wiring board technologies highlight his role as a leading inventor in Japan. His innovative patents and collaborative efforts continue to shape the industry and inspire future advancements.