The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Sep. 05, 2014
Applicant:

C. Uyemura & Co., Ltd, Osaka, JP;

Inventors:

Yoshikazu Saijo, Osaka, JP;

Hisamitsu Yamamoto, Osaka, JP;

Masayuki Utsumi, Osaka, JP;

Takuya Okamachi, Osaka, JP;

Takuya Komeda, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); C23C 18/20 (2006.01); H05K 3/18 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/381 (2013.01); C23C 18/16 (2013.01); H05K 3/181 (2013.01); H05K 2203/0776 (2013.01); H05K 2203/0783 (2013.01); H05K 2203/0789 (2013.01);
Abstract

A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: CH—(OCH)—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: CH—(OCH)—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.


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