C.uyemura Co., Ltd.

C. Uyemura & Co., Ltd.

Takuya Komeda

Hisamitsu Yamamoto

Masayuki Utsumi

Yoshikazu Saijo

Tetsuji Ishida

Takuya Okamachi

Kazunari Kato

Ryoyu Shimizu

A copper etching solution contains an oxidizing agent and an amine compound. The oxidizing agent is one or more selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate, and the amine compound has one or more primary amino groups or secondary amino groups.

Copper etching solution

The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.

Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same

A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: CH&#x2014;(OCH)&#x2014;OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: CH&#x2014;(OCH)&#x2014;OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.

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Osaka, Japan

Takuya Komeda