Asaka, Japan

Takumi Tandou

USPTO Granted Patents = 15 

Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 25(Granted Patents)


Location History:

  • Asaka, JP (2010 - 2016)
  • Hikari, JP (2017)
  • Tokyo, JP (2018 - 2020)

Company Filing History:


Years Active: 2010-2020

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15 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Takumi Tandou

Introduction

Takumi Tandou is a prominent inventor based in Asaka, Japan. He has made significant contributions to the field of plasma processing technology, holding a total of 15 patents. His work has been instrumental in advancing the efficiency and effectiveness of wafer processing methods.

Latest Patents

Among his latest patents, Tandou has developed a wafer processing method and a plasma processing apparatus. The wafer processing method involves a plasma processing apparatus that includes a processing chamber, a sample stage, and a processing gas supply unit. This innovative design allows for precise control of the temperature of a wafer during processing by adjusting the flow rate and type of heat transfer gas. Additionally, his plasma processing apparatus features a sample stage with a refrigerant flow path and lift pins that facilitate the vertical movement of the object being processed.

Career Highlights

Throughout his career, Takumi Tandou has worked with notable companies such as Hitachi High-Technologies Corporation and Hitachi High-Tech Corporation. His experience in these organizations has contributed to his expertise in plasma processing technologies and has enabled him to develop groundbreaking inventions.

Collaborations

Tandou has collaborated with several talented individuals in his field, including Masaru Izawa and Kenetsu Yokogawa. These collaborations have fostered innovation and have led to the development of advanced technologies in wafer processing.

Conclusion

Takumi Tandou's contributions to the field of plasma processing are noteworthy, and his inventions continue to influence the industry. His dedication to innovation and collaboration has established him as a key figure in the realm of wafer processing technology.

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